TCW-315

Best-selling unit suitable for various bonding such as soldering, thermocompression bonding, and thermal cushime!

High reliability bonding heating and cooling while pressurized, it is possible to join by suppressing positional deviations in the workpiece.
Various temperature profiles local and instantaneous heating suppresses the heat effect on peripheral parts.
High reproducibility Digital PID control provides good temperature and time reproducibility, eliminating the need for skilled workers.
Lead-free compatible by setting high temperature and long-term heating, it is compatible with lead-free solder.
User interface RS-232C&O is standard, making it easy to connect to external devices such as automatic machines.
Various monitoring functions temperature monitor (average value, peak value) abnormal detection (temperature overtemperature, thermocouple disconnection, etc.)
Other functions setting condition memory (15 conditions) solenoid valve control for heater tip/tool cooling auxiliary thermocouple monitor (1 system).

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High Reliability Bonding

Best Selling Unit

High Reproducibility Digital PID Control

Item	TCW-315
Heating temperature	Room temperature to 600° C 1° CStep E, J type Room temperature to 900° C K type (optional)
Heating time	000-999 (x1 00ms, x1 Oms)
Rated capacity	750VA (50%)
Heat control	2 steps
Monitor function	temperature
Interface	RS-232C, I/O
Trance	built-in
Transformer secondary voltage	0.88V, 1.24V. 1.75V. 2.47V. 3.5V
Power	Single-phase AC200V-230V+10% 15A(Options: AC100-115V)*
External dimensions / mass	W200 X D320 X H283mm =19.5kg